IC Substrate Industry For Global and China Market
Global and China ICC Substrate Industry Report, 2014-2015 Summary The Global ICC Substrate Industry market scale is expected to grow at a rate of 9. 8% in 2014, and then speed up to 11. 6% in 2015. ICC Substrate Industry falls into three camps I. E. Japan, Korea and Taiwan. Japanese companies as the ICC substrate pioneer have the strongest technical strength, mastering the most profitable CPU substrate.
Korean and Taiwanese companies rely on the industrial chain cooperation, the former hold about 70% of the world’s memory capacity; the Apple’s processor foundry provider Samsung also can produce part of mobile phone chips. Taiwanese companies are more powerful in the industrial chain by possessing 65% of global foundry production capacity and 80% of senior mobile phone chip foundry (by ATSC or COMIC), whose margin is much higher than that of traditional electronic products, (gross margin) exceeding 50%.
Mediates MATTER, for instance, the foundry is charged by ATSC or COMIC, the packaging is completed by EASE and SPILL, the substrate is offered by Kink’s and testing by SKYE; sharing the same factory, these vendors are pretty high-efficient. The utterly disadvantaged Mainland Chinese companies in the industrial chain lack support from foundries and packaging companies, lagging behind Taiwanese counterparts several even a dozen years. Even Historical and Spreader’s have impressive shipments, Taiwanese companies still hold the discourse right of the supply chain.
View Complete Report @ http:// www. chinamarketresearchreports. Com/114861 . HTML . Global and China ICC Substrate Industry Report, 2014-2015 contains the following points: Status quo of global semiconductor industry Introduction of ICC substrate Analysis on ICC substrate market Analysis on ICC substrate industry Research on 11 ICC substrate vendors Research on the world’s top 4 ICC substrate packaging companies PC (printed circuit board) Industry can be divided into three broad categories I. E. Rigid PC, flexible PC (FPC) and substrate.
ICC substrate industry suffered a continuous decline in 2012 and 2013, rooted in two aspects: first, the PC shipment declined, and CPU substrate as the main type of ICC substrate enjoyed the highest average selling price (ASP); second, to suppress the development of Japanese and Taiwanese ICC substrate vendors, Korean companies slashed price, Samsung Electro-Mechanics (SEEMS), in particular, implemented a nearly 30% price cut. This led to the global ICC substrate industry market scale down 10. 3% to SUDS. 568 billion in 2013.
